Mold opening for liquid cooled aluminum profiles

Liquid-cooled plate aluminum profile, a liquid-cooled cooling core component specially developed for high-power AI servers and GPU computing power equipment. The penetration rate of liquid cooling cooling solutions continues to increase in the data center and enters the outbreak period after 2026. Compared with copper materials, aluminum materials have obvious advantages in terms of cost, weight and large-scale processing capacity, and their application in rack-level and server-level cold plate systems continues to increase. It adopts a porous channel integrated extrusion process, integrally formed without splicing welds, high heat exchange efficiency, strong sealing reliability, and eliminates the risk of liquid leakage from the source.

01 Quality starts with raw materials

It is produced with A00 primary aluminum ingot and does not contain scrap aluminum, which ensures the uniform material and stable mechanical properties of the aluminum profile.

02 One-piece extrusion runner molding

Combined with CFD fluid simulation to optimize the flow channel topology, the flow channel is smooth and seamless, the flow resistance of the coolant is small, and the heat exchange is uniform. Compared with the welded cold plate, the integrated extrusion profile has no weld leakage risk, and the heat transfer efficiency is increased by more than 15%.

03 High-precision quality control

Precision machining with slow wire walking is adopted, and the accuracy of the mold cavity is controlled within ± 0.02 mm. The flatness of the substrate is ≤ 0.03 mm/100mm, which perfectly matches the chip package and the compression of the seal. The finished product can be matched with helium mass spectrometry to detect leakage, and the leakage rate is less than 1 × 10 Pa · m ³/s.

04 Anti-corrosion strengthening process

For common coolants such as ethylene glycol aqueous solution, the inner flow channel can be specially passivated or anodized for anti-corrosion treatment, and the electrochemical corrosion resistance is improved by more than 3 times. The service life of the cold plate is extended to more than 8 years.

05 Autonomous control of all processes

Autonomous control of all processes of mold development, hot extrusion, aging treatment, and CNC finishing. The stroke of several imported machine tools and ultra-long aluminum profile processing centers is up to 6.5 meters, and the processing accuracy can reach ± 0.01-0.005mm.

06 Yangtze River Delta Local Package

The factory is located in Qingpu, Shanghai, and provides in-depth services to computing power industry clusters such as Lingang, Zhangjiang, and Suzhou. Engineers can be arranged to meet the technical needs of door-to-door docking within 24 hours, and transportation collisions can be reduced nearby.

Processing capacity parameters:

Typical scenarios:

• GPU Training Server Liquid Cooling Board

• AI inference server cold plate

• Liquid-cooled hashrate cluster heat dissipation module

• Edge Hash Node Liquid Cooling Assembly

• Smart Computing Center Server Cold Plate

• Data Center Liquid Cooling Cooling System

• Energy storage converter liquid cooling

FAQ (Frequently Asked Questions)

Q1: What is the difference between an extruded liquid cooling plate and a welded liquid cooling plate?

A: The flow channel of the integrated extrusion liquid cold plate is formed once through the mold, without splicing welds, eliminating the risk of liquid leakage from the source. The flow channel is smooth and seamless, the flow resistance of the coolant is small, the heat exchange is uniform, and the heat exchange efficiency is increased by more than 15% compared with the welded cold plate. There is a risk of weld leakage in the welded cold plate, and the flow channel at the weld is discontinuous and the local flow resistance increases. The one-piece extruded liquid-cooled plate is adapted to the AI computing power cluster liquid-cooled cooling system with a single cabinet power of 20kW or more.

Q2: What flow channel structures can be customized for liquid-cooled plate aluminum profiles?

A: A variety of internal flow channel structures can be customized, such as serpentine flow channels (suitable for uniform heat dissipation requirements), shunt flow channels (suitable for large flow and low flow resistance requirements), and microchannel flow channels (suitable for high heat flow density scenarios). Combined with CFD fluid simulation, the flow path topology is optimized to meet the heat dissipation needs while controlling the flow resistance within a reasonable range. Minimum flow path width 3mm.

Q3: Why is the substrate flatness of liquid-cooled plate aluminum profiles required to be so high?

A: The liquid cooling plate needs to be tightly attached to the chip or the surface of the heat source, and the flatness directly determines the size of the contact thermal resistance. The flatness of the substrate ≤ 0.03 mm/100mm can ensure that there is no gap fit between the liquid cooling plate and the chip, and the contact thermal resistance is the lowest. Insufficient flatness will lead to poor local contact and heat accumulation, seriously affecting the heat dissipation efficiency, and even causing the chip to overheat and degrade or damage.

Q4: How do aluminum profiles of liquid-cooled plates prevent coolant leakage?

A: Leakage prevention through three lines of defense: design end - one-piece extrusion without splicing weld, preventing weld leakage from the source; processing end - precision machining with slow-walking wire, the cavity accuracy is controlled within ± 0.02 mm; detection end - finished product supporting helium mass spectrometry leakage, leakage rate is less than 1 × 10 ² Pa · m ³/s. Three lines of defense ensure zero leakage for long-term operation of the liquid-cooled plate.

Q5: What materials can be used for aluminum profiles of liquid-cooled plates?

A: 6061-T6 high-strength aluminum alloy (excellent comprehensive performance, suitable for most liquid-cooled plate applications), 3003 anti-rust aluminum alloy (good corrosion resistance, suitable for long-term water-cooling cycle scenarios), high thermal conductivity aluminum alloy (better thermal conductivity) can be selected. Our company recommends the most suitable material scheme according to the customer's thermal design power, coolant type and use environment.

Q6: What is the minimum order quantity and delivery time for aluminum profiles for liquid-cooled sheets?

A: Support 10 tablet level R&D proofing, suitable for early verification and testing of AI server liquid cooling solutions. The conventional structural mold opening cycle is 7-10 days, and the samples are delivered 12-20 days after the batch delivery period is confirmed. Liquid-cooled plate projects usually have tight lead times, and our company supports accelerated production scheduling.