High Thermal Conductivity Pure Aluminum Heat Sink Profiles

High thermal conductivity pure aluminum heat sink profile, developed for high-power-density equipment cooling applications. In applications with limited thermal design space and high power density, selecting a high-thermal-conductivity material is more effective than simply increasing heat dissipation area. The thermal conductivity of the 1070 pure aluminum series can reach 226W/(m·K), over 10% higher than conventional 6063 aluminum alloy (approximately 201W/m·K), making it a cost-effective high-thermal-conductivity solution.

Shanghai Chuangsi Aluminum Co., Ltd. serves high-power LED heat sinks, laser equipment cooling profiles, industrial power supply heat sinks, and communication equipment high-thermal-conductivity heat sinks. Using integrated extrusion forming, heat dissipation efficiency is far higher than assembled heat sinks, supporting customization of dense-fin, thin-fin, and multi-fin structures.

Core advantages at a glance:

01 Quality Starts From Raw Materials

Produced using 1070 pure aluminum series primary aluminum ingot, containing no scrap aluminum, with stable thermal conductivity and strong heat dissipation consistency within the same batch. Pure aluminum has superior thermal conductivity compared to alloy aluminum, making it the ideal choice for high-thermal-conductivity cooling solutions.

02 High Thermal Conductivity Pure Aluminum Extrusion

The thermal conductivity of 1070 pure aluminum can reach 226W/(m·K), over 10% higher than conventional 6063 aluminum alloy (approximately 201W/m·K). Integrated extrusion forming delivers heat dissipation efficiency far higher than assembled heat sinks, with no contact thermal resistance loss.

03 Precision Fin Machining

Supports customization of dense-fin, thin-fin, and multi-fin structures; minimum fin thickness can reach 0.5mm, with a maximum fin height ratio of 15:1. Fin thickness deviation is controlled within ±0.03mm, and base plate flatness is ≤0.05mm/100mm.

04 Multi-Scenario Adaptation

Suitable for high-power LED cooling, laser equipment cooling, industrial power supply cooling, and communication equipment cooling in various high-power-density scenarios. Surface can be natural-color anodized or black anodized to improve thermal radiation efficiency.

05 Independent Control of All Processes

From extrusion and CNC precision machining to surface treatment, all processes are completed in-house with no outsourcing. Supports custom mold development for non-standard cross-sections, 50kg minimum order, 7-10 days for conventional structure samples.

Machining capability parameters:

Material thermal conductivity comparison:

High thermal conductivity pure aluminum heat sink vs. standard 6063 aluminum alloy heat sink:

Typical application scenarios:

• High-power LED heat sinks

• Laser equipment cooling profiles

• Industrial power supply heat sinks

• Communication equipment high-thermal-conductivity heat sinks

• Variable frequency drive cooling profiles

• High-power-density electronic equipment cooling components

FAQ (Frequently Asked Questions)

Q1: What is the difference in heat dissipation performance between 1070 pure aluminum and 6063 aluminum alloy?

A: The thermal conductivity of 1070 pure aluminum can reach 226W/(m·K), over 10% higher than conventional 6063 aluminum alloy (approximately 201W/m·K). In applications with limited thermal design space and high power density, selecting a high-thermal-conductivity material is more effective than simply increasing heat dissipation area. 1070 pure aluminum is a cost-effective high-thermal-conductivity solution, especially suitable for cooling high-power-density equipment such as high-power LEDs, laser equipment, and industrial power supplies.

Q2: What are the applicable scenarios for high thermal conductivity pure aluminum heat sinks?

A: High thermal conductivity pure aluminum heat sinks are suitable for scenarios with limited thermal design space but high power density — that is, where internal installation space is constrained and heat dissipation efficiency cannot be improved by increasing area, so a higher-thermal-conductivity material compensates for the space limitation. Typical applications include high-power LED heat sinks, laser equipment cooling profiles, industrial power supply heat sinks, communication equipment high-thermal-conductivity heat sinks, variable frequency drive cooling profiles, and high-power-density electronic equipment cooling components.

Q3: Why is the thermal conductivity of 1070 pure aluminum higher than that of 6063 aluminum alloy?

A: The aluminum content of 1070 pure aluminum is as high as 99.7% or more, with extremely low alloying element content. 6063 aluminum alloy contains alloying elements such as magnesium and silicon (total content approximately 1.5%), which increase material strength but also increase electron scattering and reduce thermal conductivity. Therefore, pure aluminum has higher thermal conductivity than aluminum alloy and is more advantageous in high-thermal-conductivity applications.

Q4: What surface treatments are available for high thermal conductivity pure aluminum heat sinks?

A: We offer natural-color anodizing (preserving the pure aluminum metallic finish), black anodizing (improving thermal radiation efficiency, suitable for natural convection cooling scenarios), and sandblasting (uniform surface texture). High thermal conductivity pure aluminum heat sinks are especially valuable in scenarios requiring ultimate heat dissipation performance that cannot be achieved by increasing heat dissipation area.

Q5: What is the minimum order quantity and lead time for high thermal conductivity pure aluminum heat sinks?

A: The minimum order quantity is 50kg. Mold development for conventional structures takes 7-10 days for samples, and batch delivery is 7-12 days. Due to high material purity, high thermal conductivity pure aluminum heat sinks have better extrusion formability than 6063 aluminum alloy and a relatively stable production cycle.

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