AI Server Liquid Cooling Plate Aluminum Profiles

AI server liquid cooling plate aluminum profiles - AI chip power consumption keeps climbing; single-chip thermal design power (TDP) has broken through from 700W to over 1000W, and liquid cooling has gone from 'optional' to 'mandatory'. The liquid cooling plate is the core component of the liquid cooling system, and its manufacturing process is undergoing a technical iteration from welded to one-piece extrusion.

Shanghai Chuangsi Aluminum develops AI server liquid cooling plate aluminum profiles specifically for AI training servers, GPU computing clusters and data center liquid cooling systems, focusing on the core requirements of cold-plate liquid cooling for profiles: 'precise flow channels, uniform wall thickness, high flatness, pressure and corrosion resistance'. Adopting multi-channel integrated extrusion technology combined with CFD fluid simulation to optimize flow channel topology, the channels are smooth and seamless with low coolant flow resistance and uniform heat exchange. One-piece extrusion has no spliced welds, eliminating leakage risk at the source.

Core advantages at a glance:

01 Quality Starts From Raw Materials

Produced from A00 primary aluminum ingot, containing no scrap aluminum, with uniform material and stable mechanical properties, ensuring sealing reliability of liquid cooling plates under long-term operation. Uses 6061-T6 high-strength aluminum alloy or 3003 rust-proof aluminum alloy.

02 One-Piece Extruded Flow Channel Forming

Combined with CFD fluid simulation to optimize flow channel topology, formed by precision die one-piece extrusion; channels are smooth and seamless. Compared with welded cold plates, one-piece extruded profiles have no weld leakage risk, over 15% higher heat exchange efficiency, and service life up to over 8 years.

03 High-Precision Quality Control

Using wire-EDM precision machining, cavity accuracy controlled within ±0.02mm. Base flatness ≤0.03mm/100mm, perfectly matching chip packaging and seal compression. Finished products can be tested with helium mass spectrometry leak detection, leak rate below 1x10⁻⁶ Pa·m³/s.

04 Corrosion-Resistant Enhancement Process

For common coolants such as ethylene glycol aqueous solution, inner channels can receive dedicated passivation or anodizing anti-corrosion treatment, improving electrochemical corrosion resistance by over 3 times. Cold plate service life is extended to over 8 years.

05 Full-Process Self-Management

Full process of mold development, hot extrusion, aging treatment and CNC precision machining is self-managed. Machining precision up to ±0.01-0.005mm, ensuring precise channel dimensions and uniform wall thickness.

Machining capability parameters:

One-piece extruded liquid cooling plate vs welded liquid cooling plate:

AI server liquid cooling plate vs battery liquid cooling plate:

Typical application scenarios:

• AI training server liquid cold plates

• GPU computing cluster heat dissipation modules

• Data center liquid cooling systems

• Intelligent computing center server cold plates

• Edge computing node liquid cooling components

• HPC high-performance computing liquid cooling plates

FAQ (Frequently Asked Questions)

Q1: What is the difference between one-piece extruded liquid cooling plates and welded liquid cooling plates?

A: The flow channels of one-piece extruded liquid cooling plates are formed in one shot by die with no spliced welds, eliminating leakage risk at the source. Channels are smooth and seamless with low coolant flow resistance and uniform heat exchange; heat exchange efficiency is over 15% higher than welded cold plates, and service life can reach over 8 years. Welded cold plates carry weld leakage risk, and channels are discontinuous at welds with increased local flow resistance. As AI chip power consumption keeps climbing and single-chip thermal design power (TDP) has broken through from 700W to over 1000W, liquid cooling has gone from 'optional' to 'mandatory'; one-piece extruded liquid cooling plates are the mainstream solution for AI server liquid cooling.

Q2: What types of flow channel structures can be customized for AI server liquid cooling plates?

A: We can customize various internal flow channel structures such as serpentine channels (for uniform heat dissipation needs), split-flow channels (for high-flow low-resistance needs), and microchannel channels (for high heat flux density scenarios). Combined with CFD fluid simulation to optimize flow channel topology, we control flow resistance within a reasonable range while meeting heat dissipation needs. Min. channel width 3mm, channel dimensional tolerance ±0.05mm.

Q3: Why does AI server liquid cooling plate base flatness need to be ≤0.03mm/100mm?

A: The liquid cooling plate must fit tightly against the chip or heat source surface, and flatness directly determines the contact thermal resistance. Base flatness ≤0.03mm/100mm ensures gap-free contact between the liquid cooling plate and the chip for minimum contact thermal resistance. Insufficient flatness causes local poor contact and heat accumulation; for AI chips with TDP over 1000W, local hot spots may cause chip throttling or even damage.

Q4: How does the AI server liquid cooling plate guarantee no long-term leakage?

A: Leakage is prevented through three lines of defense: first, at the design stage - one-piece extrusion with no spliced welds eliminates weld leakage at the source; second, at the machining stage - wire-EDM precision machining with cavity accuracy controlled within ±0.02mm; third, at the inspection stage - finished products are tested with helium mass spectrometry leak detection, leak rate below 1x10⁻⁶ Pa·m³/s. The three lines of defense ensure zero leakage over long-term operation, with service life up to over 8 years.

Q5: What is the MOQ and lead time for AI server liquid cooling plates?

A: Supports 10-piece-level R&D sampling, suitable for early validation and testing of AI server liquid cooling solutions. Mold development lead time for standard structures is 7-10 days for sampling; bulk delivery is 12-20 days after sample approval. Liquid cooling projects usually have tight lead times, and we support expedited scheduling. The factory is located in Qingpu, Shanghai, deeply serving the Lin'gang, Zhangjiang, Suzhou and other computing industry clusters.

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